ASRock ATX DDR3 1066 LGA 1150 Motherboards Z97 EXTREME6/AC

The extra large aluminum alloy heatsinks take away heat dramatically. As the MOSFETs and chipsets areas are well covered by these heatsinks to protect them from overheating, MOSFET and chipsets can perform with lower temperature, and your motherboard and system will be more stable and reliable. The new generation alloy chokes effectively increase up to 90% saturation current and feature a highly magnetic and heat resistant design, making the motherboard more efficient, stable and reliable. Dual-Stack MOSFET (DSM) is another innovative MOSFETs design by ASRock. The silicon die area is increased by stacking two dies into one MOSFET. The larger the die area, the lower Rds(on). Compared to traditional discrete MOSFET, DSM with larger die area provides extreme lower Rds(on) 1.2 mΩ, so the power supply for the CPU Vcore is more efficient. The next generation NexFET MOSFETs control the power supply to DRAM slots more efficiently. They provide lower RDS(on) 2.9 mΩ, delivering higher efficiency and lower temperature. NexFET MOSFETs in memory areas use a special design for protecting them from electrostatic discharge and offer up to 7.5 times the ESD protection levels compared to traditional MOSFETs. Supreme 12K platinum capacitors with lifespans of at least 12,000 hours. Compared to other counterparts on high-end motherboards that merely have lifespans of around 10,000 hours, AS Rock applied Nichicon 12K Platinum Caps that offer 20% longer lifespans and provide more stability and reliability. Pure black PCB appearance. The new Sapphire Black PCB represents rock-solid quality and gives the motherboard a more mysterious touch.

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